Description
In consideration of the increasing demand for multifunctional mechatronic systems, MID technology offers promising potential for the production of highly integrated mechatronic assemblies in function-optimized designs. However, uncertainties with regard to quality and reliability inhibit the use of customized MID solutions, in particular in rough and safety-relevant areas. In this context, key factors influencing quality along the multi-stage and interdisciplinary manufacturing process of LDS-MID are highlighted and necessary measures for quality assurance in manufacturing explained. The further main focuses of the present work result from the characteristic failure causes and restrictions, which impair a broader expansion of LDSMID. These are the delamination of the metallization, the formation of conductor cracks as well as the thermal damage of conductors. Derived from this, systematic investigations pursue the objectives to determine and increase the adhesion strength of LDS metallization, to avoid conductor cracks under thermal load and to significantly increase the current carrying capacity by the use of metal core MID. Based on the methods and findings developed, existing uncertainties regarding the suitability of LDS applications for use in demanding fields of application are reduced and useful indications for an effective enhancement of the robustness of LDS-MID are presented.
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