Qualifizierung des Montageprozesses hochminiaturisierter elektronischer Bauelemente

Description

The growing market of microelectronics is characterized by the inte-gration of new interconnection technologies on electronic assem-blies. Especially for applications of medical devices, automotive or industry, increased demands are placed on the process and system technology. Introduction of smaller components into existing pro-duction environments represents major challenges to the involved process steps in surface mount technology. In addition, the engineer-ing of the electronic modules in their process design is already strongly affected by these influences.

As part of the research work, key trends in current developments have been taken up and their effects on the entire process chain an-alyzed. The results on the stencil printing process help to determine process windows for a secure application of the interconnection medium. With precise knowledge of the boundary conditions, even highly miniaturized components can be reliably processed with an automated placement and final soldering process in the SMT. In addition to the exact knowledge of the individual processes, a cross-process consideration is increasingly important for robust produc-tion processes of complex assemblies. A comprehensive assessment of the determining factors and the consistent optimization of the process parameters make it possible to implement the introduction of miniaturized components even for challenging applications.