Laser Powder Bed Fusion von Kupfer auf Aluminiumoxid-Keramiken

Description

Due to the increasing electrification of various industrial sectors, such as mobility and energy supply, the demand for power electronic current transformers is also growing. Conventional circuit carriers in the field of power electronics, e.g. DCB and AMB substrates, in addition to the limited possibility of flexible production, also have limitations with regard to the vertical integration of active and passive components as well as thermal management.
Using Additive Manufacturing, the method of Laser Powder Bed Fusion (LPBF) enables the fabrication of 3D metallizations on ceramic substrate materials, thus providing new possibilities for the application of power electronic circuit carriers.
The dissertation presented, significantly addresses both areas, the LPBF of copper and the fabrication of a composite material consisting of copper and aluminum oxide in the same process. By means of a 500 W Yb:YAG laser, studies with respect to the processing of copper powder is carried out, and the main factors influencing its melting and process behavior are identified. Parameter combinations can be determined which enable the processing of copper without altering its conventional characteristics. Furthermore, by adapting laser parameters to selected layers, aluminum oxide ceramics can be bonded to copper with the emergence of a reaction zone.